Semiconductor chip, e.g. air flow sensor chip, assembling method, involves assembling chip mounting area on carrier surface area by flip-chip technology, and assembling profile device mounting area such that chip is embedded into device

摘要

The method involves providing a semiconductor chip (5``) with a surface area that has a membrane region and a periphery region, where the periphery region has a mounting area (MB). The mounting area of the chip is assembled on another surface area of a carrier by flip-chip technology. The mounting area is under filled with an under filling (28), and a profile device (150) is provided. Another mounting area (MB`) of the profile device is assembled on the surface area of the carrier such that the semiconductor chip is partially embedded into the profile device. An independent claim is also included for a semiconductor chip assembly comprising a semiconductor chip with a surface area.