HIGH-SPEED RFID CIRCUIT PLACEMENT METHOD AND DEVICE

摘要

A high-speed machine and method for placing an RFID circuit (38, 58) onto an electrical component includes separating an RFID circuit (38, 58) from a web of RFID circuits, and placing the RFID circuit (38, 58) onto an electrical component with a placing device. The separating includes directing the RFID circuit (38, 58) onto a transfer drum (34, 54, 470, 512) of the placement device (30, 400, 500) and separably coupling the RFID circuit (38, 58) to the transfer drum (34, 54, 470, 512). According to one method, a separator device separates and directs chips or interposers onto a placement device (30, 400, 500). According to another method, chips or interposers are tested before being separated from a web, and if good, are separated from the web, directed onto a placement device (30, 400, 500), and placed on an electrical component. If defective, the chips or interposers are not directed onto a placement device (30, 400, 500) and are removed by a scrap web removal device (516).