| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve a surface-mountable optoelectronic constituting device prepared for soldering to a carrier and especially to reduce torque applied to a housing body by solder fillet. <P>SOLUTION: The housing body (1) has a notch (11) adjacent to a connection (7), and the notch (11) extending to inside of the housing body (1) from a surface (9) of a housing base. An outer solder fillet (17) is formed on a first side (15) of the housing, and an inner filet (18) is formed on a side (13) of the notch (11) adjacent to the connection portion (7). <P>COPYRIGHT: (C)2007,JPO&INPIT |
