| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in tackiness, folding endurance, low stress property and resistance to the heat of soldering and having good alkali developability and insulation, and to provide a wiring circuit board obtained using the same. <P>SOLUTION: The photosensitive resin composition contains (A) a carboxyl group-containing linear polymer, (B) a polymerizable compound containing an ethylenically unsaturated group, (C) a photopolymerization initiator, (D) an epoxy resin represented by formula (1) and (E) at least one of a bisphenol A type epoxy resin having a weight average molecular weight of 900-60,000 and a bisphenol F type epoxy resin having a weight average molecular weight of 900-60,000. The photosensitive resin composition has a storage elastic modulus at 25°C before ultraviolet exposure being 10-800 MPa. <P>COPYRIGHT: (C)2007,JPO&INPIT |
