| 摘要 |
PROBLEM TO BE SOLVED: To provide a gasket structure, capable of adapting a pressure inside the container used for housing, storage, and transportation, etc. of many sheets of thin substrates, such as the semiconductor wafer to any change in the atmospheric pressure environment. SOLUTION: The gasket 6 is attached between the main container body and the lid, where the tip of the abutting thin strip 6d served as a sealing portion is displaced from directly below its substrate mating interface 6a toward the outside direction with a "chevron"-shaped flexural stretching portion 6b. When this gasket-attached lid is fitted to the container body, the abutting thin strip 6d serving as a sealing portion is fitted to a seal groove of which cross-sectional surface is circular. When the atmospheric pressure difference arises between the container and ambient environment, this abutting thin strip 6d having an elasticity is sucked into the lower pressure side to glide along the seal groove. During this gliding, a small gap is made at the contacting area, to give the ventilation between a gas inside the container and open air, thus causing no deformation of the container to be produced and preventing particles in the air from being taken into the container. COPYRIGHT: (C)2007,JPO&INPIT |
