发明名称 |
Substrate processing apparatus and substrate processing method |
摘要 |
The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.
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申请公布号 |
US2006243204(A1) |
申请公布日期 |
2006.11.02 |
申请号 |
US20060454790 |
申请日期 |
2006.06.19 |
申请人 |
KATSUOKA SEIJI;SEKIMOTO MASAHIKO;YOKOYAMA TOSHIO;WATANABE TERUYUKI;OGAWA TAKAHIRO;KOBAYASHI KENICHI;MIYAZAKI MITSURU;MOTOSHIMA YASUYUKI;OWATARI AKIRA;DAI NAOKI |
发明人 |
KATSUOKA SEIJI;SEKIMOTO MASAHIKO;YOKOYAMA TOSHIO;WATANABE TERUYUKI;OGAWA TAKAHIRO;KOBAYASHI KENICHI;MIYAZAKI MITSURU;MOTOSHIMA YASUYUKI;OWATARI AKIRA;DAI NAOKI |
分类号 |
B05C3/02;B05C19/02;C23C18/16;C25D7/12;C25D17/00;H01L21/00;H01L21/677;H01L21/687 |
主分类号 |
B05C3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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