发明名称 |
Method for manufacturing a heat-dissipating structure of a rectifier |
摘要 |
A method for manufacturing a heat-dissipating structure of a rectifier combines heat pipes into the heat-dissipating structure of the rectifier to enhance the heat-dissipating efficiency thereof. A metal tube of a heat pipe is has an inlet. A wick structure is formed inside the metal tube. The inlet of the metal tube is sealed. The metal tube is disposed in a mold of a heat-dissipating shell. A melted metal is cast into the mold and forms a heat-dissipating shell. The heat-dissipating shell is taken out from the mold. The sealed inlet of the metal tube in the heat-dissipating shell is cut. The metal tube is filled with a working fluid. The inlet of the metal tube is sealed. |
申请公布号 |
EP1717536(A1) |
申请公布日期 |
2006.11.02 |
申请号 |
EP20050009006 |
申请日期 |
2005.04.25 |
申请人 |
ACTRON TECHNOLOGY CORPORATION |
发明人 |
SHEEN, CHARNG-GENG |
分类号 |
F28D15/02;F28F21/08;H02K11/04 |
主分类号 |
F28D15/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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