发明名称 Method for manufacturing a heat-dissipating structure of a rectifier
摘要 A method for manufacturing a heat-dissipating structure of a rectifier combines heat pipes into the heat-dissipating structure of the rectifier to enhance the heat-dissipating efficiency thereof. A metal tube of a heat pipe is has an inlet. A wick structure is formed inside the metal tube. The inlet of the metal tube is sealed. The metal tube is disposed in a mold of a heat-dissipating shell. A melted metal is cast into the mold and forms a heat-dissipating shell. The heat-dissipating shell is taken out from the mold. The sealed inlet of the metal tube in the heat-dissipating shell is cut. The metal tube is filled with a working fluid. The inlet of the metal tube is sealed.
申请公布号 EP1717536(A1) 申请公布日期 2006.11.02
申请号 EP20050009006 申请日期 2005.04.25
申请人 ACTRON TECHNOLOGY CORPORATION 发明人 SHEEN, CHARNG-GENG
分类号 F28D15/02;F28F21/08;H02K11/04 主分类号 F28D15/02
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