Sputtering target, e.g. tubular target with carrier and sputtering material, useful in coating large surface substrates such as architectural glass or flat screen plates has free flowing heat and electricity

摘要

A sputtering target, especially a tubular target (sic) has a carrier and sputtering material with a free flowing heat and electricity conducting powder or granulate fill between the carrier and sputtering material. The powder or granulate can contain one or more of Al, Cu, Sn, In, Ag, In, Fe, Ni, W, or C, and can contain a matrix material, e.g. a solder or an organic or inorganic polymer.