摘要 |
<p>The structure has a flash memory wafer (2), and contacts electrically connected with contacts of a connection part of a base (1), where a lower part of the wafer is electrically connected with the connection part. A housing has a frame, and a metal plate lies in the center of the frame, so that the housing has a hollow space for a wafer controller that includes a passive module and the wafer. A detention layer is provided between the base and frame, where both sides of the layer are respectively bonded to an edge of the base and a surface of the frame.</p> |