发明名称 RADIATION SENSITIVE RESIN COMPOSITION, INTERLAYER INSULATION FILM AND MICROLENS
摘要 <P>PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition having no problem with safety, excellent in sensitivity, resolution and storage stability, having good development margin, capable of forming an interlayer insulation film having excellent solvent resistance, heat resistance, light transmittance and adhesion, and capable of forming microlenses having excellent solvent resistance, heat resistance, light transmittance and adhesion, and also having a good melt shape. <P>SOLUTION: The radiation sensitive resin composition contains [A] an alkali-soluble copolymer obtained by copolymerizing (a1) an unsaturated carboxylic acid and/or an unsaturated carboxylic acid anhydride, (a2) an unsaturated compound having an oxetane ring structure and (a3) an olefinically unsaturated compound other than the above components, [B] a 1,2-quinonediazido compound and [C] an antimony-free thermosensitive acid generating compound. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006301365(A) 申请公布日期 2006.11.02
申请号 JP20050124035 申请日期 2005.04.21
申请人 JSR CORP 发明人 HAMADA KENICHI;MINOWA TAKAKI;KAJITA TORU
分类号 G03F7/023;G02B3/00;G03F7/004;G03F7/40 主分类号 G03F7/023
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