发明名称 SUBSTRATE FOR SURFACE-MOUNTING LED AND METHOD OF MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate for surface-mounting LEDs which has a high product reliability against vibration, external pressure, etc., can be easily manufactured at a low cost, and can have independent control over one or a plurality of LED elements. <P>SOLUTION: The method of manufacturing the substrate for surface-mounting LEDs comprises a process wherein a copper foil 3 is processed in a three-layer substrate 4 made by fixing the copper foil 3 on the top face of an aluminum plate 1 via an insulation layer 2, with three or more demarcated circuits left while removing the other portion of the copper foil; a process of plating a portion of each circuit existing on the surface Pa to be embossed with silver (Ag); a process of forming counterbore holes 4a in the bottom face of the aluminum plate 1 on the opposite side from the surface Pa to be embossed; and a process wherein the surface Pa to be embossed is embossed by an embossing die 50 in a direction of squashing the counterbore holes 4a from above, to form concave portions P having a side wall which is inclined inward as it goes downward and a bottom face surrounded by the side wall. In the concave portions P made by embossing, three or more electrodes are formed having a superior conductivity and light reflectivity. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006302979(A) 申请公布日期 2006.11.02
申请号 JP20050119080 申请日期 2005.04.15
申请人 HOTTA TEKKO KK 发明人 MIYAMOTO TOSHIYUKI
分类号 H01L33/58;H01L33/60;H01L33/62 主分类号 H01L33/58
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