| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing die bond sheet in which a part to be bonded to a dicing frame is not required to be specially processed, and it is possible to bond the sheet to a wafer at a normal temperature. SOLUTION: The dicing die bond sheet has a sticky/adhesive layer formed by laminating a sticky layer and a adhesion layer in this order on a base film. In the dicing die bond sheet, the adhesion layer comprises at least two layers, and the outermost layer of the adhesion layer comprises a radiation curing resin composition, and the adhesion layer in contact with the sticky layer comprises a thermal curing resin composition. COPYRIGHT: (C)2007,JPO&INPIT |
