| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device in which connection reliability is enhanced by preventing disconnection at the joint of interconnect lines when an interconnect line is formed to be connected with a substrate on which an interconnect line is formed through a level difference, and to provide its fabrication process. SOLUTION: A seating 10 is provided on a substrate 5 where a first interconnect line 20 is formed, a second interconnect line 25 is formed on the seating 10, and the second interconnect line 25 is connected with the first interconnect line 20 on the substrate 5. At least a part of the end face of the seating 10 is an inclining face 10a making an acute angle to the upper surface of the substrate 5. Other component 30 is provided on the seating 10 and connected with the second interconnect line 25. COPYRIGHT: (C)2007,JPO&INPIT |
