ELECTROCONDUCTIVE ADHESIVE SHEET AND CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide an electroconductive adhesive sheet which is used for electrically connecting a substrate with components and a circuit board in which the substrate and the components are electrically connected. SOLUTION: The adhesive sheet is provided with an electroconductive adhesive layer containing a low-melting metal powder and a metal powder having a higher melting point than the low-melting metal powder. The average particle sizes of the low-melting metal powder and the higher-melting metal powder are 10-100μm. In the circuit board, the substrate having electrodes on the surface and the components are bonded and electrically connected on the surface side of the substrate with the electroconductive adhesive layer containing the low-melting metal powder having an average particle size of 10-100μm and the metal powder having a higher melting point than the low-melting metal powder and an average particle size of 10-100μm. COPYRIGHT: (C)2007,JPO&INPIT