| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating method capable of coping with speeding up with a simple equipment configuration which does not require application of an adhesive and application of a flux before and after the application of metallic powder and granular materials to a metal band and an ancillary process, such as compression bonding. SOLUTION: The powder and granular material of the metal or alloy to be coated by a metal powder and granular material applicator is electrostatically charged and is applied to the metal band 11 and the metal band 11 is heated to the temperature higher than the melting point of the powder and granular materials by an induction heater 14 without compression bonding the applied powder and granular materials to the metal band 11, and thereby the surface of the metal band 11 is plated with the different metal or alloy. COPYRIGHT: (C)2007,JPO&INPIT
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