| 摘要 |
PROBLEM TO BE SOLVED: To provide a case for an electronic device which can exhibit comprehensively excellent property by improving the adhesiveness between a metal layer and a fiber reinforced resin layer when the case for an electronic device is composed of a metal and a fiber reinforced resin. SOLUTION: The case for an electronics device comprises a metal/fiber reinforced resin composite material which is unified by gluing the metal layer to the fiber reinforced resin layer through an intermediate resin layer, wherein the intermediate resin layer includes particles of a thermoplastic resin having an average particle diameter of 3-10μm and an imidazole silane compound. COPYRIGHT: (C)2007,JPO&INPIT
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