发明名称 |
Semiconductor device with a rewiring level and method for producing the same |
摘要 |
A semiconductor device includes a plastic package, at least one semiconductor chip and a rewiring level. The rewiring level includes an insulating layer and a rewiring layer. The rewiring layer includes either signal conductor paths and ground or supply conductor paths arranged parallel to one another and alternately, or only signal conductor paths arranged parallel to one another. In the latter case, an electrically conducting layer of metal which can be connected to ground or supply potential is additionally provided as a termination of the rewiring level or in the form of a covering layer.
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申请公布号 |
US2006244120(A1) |
申请公布日期 |
2006.11.02 |
申请号 |
US20060362507 |
申请日期 |
2006.02.27 |
申请人 |
GOSPODINOVA-DALTCHEVA MINKA;HUEBERT HARRY;SUBRAYA RAJESH;THOMAS JOCHEN;WENNEMUTH INGO |
发明人 |
GOSPODINOVA-DALTCHEVA MINKA;HUEBERT HARRY;SUBRAYA RAJESH;THOMAS JOCHEN;WENNEMUTH INGO |
分类号 |
H01L23/48;H01L23/13;H01L23/31;H01L23/49;H01L23/498;H01L23/50;H01L23/552;H01L23/66;H01L25/065 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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