RESIN COMPOSITION AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

This invention provides a resin composition having excellent pattern embedding properties, adhesion, heat resistance, flexibility and printing properties, and a semiconductor device using the same. The resin composition comprises (A) an aromatic thermoplastic resin which is soluble in a polar solvent at room temperature, (B) an aromatic thermoplastic resin which is insoluble in a polar solvent at room temperature but is soluble in a polar solvent upon heating, (C) a filler possessing rubber elasticity and having an average particle diameter of 0.1 to 6 µm and a particle diameter distribution of 0.01 to 15 µm, and (D) a polar solvent. For the resin composition, the viscosity as measured with a rheometer under conditions of shear stress 13 Pa and frequency 5 Hz and the viscosity as measured with a rheometer under conditions of shear stress 13 Pa and frequency 50 Hz are less than 400 Pa·s and not less than 3 Pa·s, respectively, and the viscosity ratio (viscosity at a frequency of 5 Hz (Pa·s)/viscosity at a frequency of 50 Hz (Pa·s)) is not less than 2.