| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board wherein thinning and/or reduction of transmission loss is achieved. <P>SOLUTION: The wiring board 10 comprises a first conductor 20 and a second conductor 30 whose electrical potentials are equal to each other, a dielectric layer 40 provided between the first conductor 20 and the second conductor 30, and a third conductor 50 embedded in the dielectric layer 40. In the wiring board 10, the film thickness ha of the first region 42 of the dielectric layer 40 positioned between the third conductor 50 and the first conductor 20 is thicker than the film thickness hb of the second region 44 of the dielectric layer 40 positioned between the third conductor 50 and the second conductor 30. Further, the cross sectional form of the third conductor 50 is a trapezoidal shape, and angles θ1 and θ2 are obtuse angles at both ends of the third conductor 50 on the second conductor 30 side. <P>COPYRIGHT: (C)2007,JPO&INPIT |
