| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device with the external terminal having no metal burrs, and to provide its manufacturing process. <P>SOLUTION: Before an original substrate 11 is cut into individual pieces of a supporting substrate, a lower-side metal layer 14 on a cut line L and a copper plating layer 16 and a nickel/gold-plated layer 17 on the lower-side metal layer 14 are removed. Since an external terminal, consisting of the underlying metal layer 14 and the copper plating layer 16 and nickel/gold plating layer 17 deposited on the surface thereof, does not exist on the cut line L, when the original substrate 11 is cut by means of a cutting tool 12, the metal constituting the external terminal will not be dragged and elongated by the cutting tool 12 and thereby there is no risk of metal burrs being produced in the external terminal. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
