| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a through-wire board and a composite board with a high degree of designing a wire structure and provided with through-wires capable of highly dense three-dimensional mount, and to provide an electronic apparatus employing them. <P>SOLUTION: The through-wire board is provided with a base member (11) wherein a very small hole (12) tying at least two sides (11a or 11b and 11c) of the base member (11), and the through-wire (13) formed by filling a conductive substance in the very small hole (12), are provided, and at least part of the through-wire (13) is extended in a direction different from the thick direction of the base member (11) (all of the through-wire (13) in the case of Fig. 1). The composite board is disclosed, and the electronic apparatus is disclosed employing the through wire board and the composite board. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
