| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device of high reliability having outstanding electrical characteristics and outstanding heat characteristics. SOLUTION: A sheet-like heat dissipation insulator 12 is interposed between a heat sink 102 and a mounting conductor 13 in which a semiconductor element 106 is arranged, to integrate the assembly with an insulating seal 15 by a resin sealing means 11, and mounted in a cooler 103 through a conductor 14. COPYRIGHT: (C)2007,JPO&INPIT |
