| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit unit which is free from delamination of solder and capable of surely keeping a space between a circuit board and a mother board. SOLUTION: The electronic circuit unit is equipped with two or more lands 3 provided on the undersurface of the circuit board 1, and solder bumps provided to the lands 3. Suppressing walls 8a which are formed of insulating resin surrounding the peripheries of the solder bumps 7 as kept in contact with them so as to suppress the solder bumps 7 from spreading, and a link 8b which is formed of the same insulating resin as the suppressing wall 8a and links the suppressing walls 8a together, are provided. Consequently, even if the circuit board 1 is expanded and shrunk due to a temperature change in a surrounding environment, a distortion produced in the circuit board 1 is dispersed to all the link 8b, the distortions concentrating on the suppressing walls 8a are alleviated by the dispersion, and the solder bumps 7 are hardly separated off. COPYRIGHT: (C)2007,JPO&INPIT
|
