发明名称 PRINTED-WIRING BOARD AND METHOD FOR JOINING THE SAME
摘要 PROBLEM TO BE SOLVED: To reduce thermal damages of a printed-wiring board when the printed-wiring boards are joined by solder fusion. SOLUTION: The printed-wiring board 1 is electrically connected to a connection terminal 13 formed on a surface 11b of a circuit board 9 to constitute an electronic circuit together with the circuit board 9. The printed-wiring board 1 comprises a board main body 3 of a substantial plate-like shape, and a joining land 5 which is provided in the board main body 3 and joined to the connection terminal 13 of the circuit board 9. The joining land 5 is exposed outward from the front and rear face 3b, 3c of the board main body 3. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006303354(A) 申请公布日期 2006.11.02
申请号 JP20050126206 申请日期 2005.04.25
申请人 OLYMPUS CORP 发明人 MORIYA NOBUO
分类号 H05K1/14;H05K3/34 主分类号 H05K1/14
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