| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure and a method for fixing an electronic component capable of easily and surely fixing the electronic component to a substrate. SOLUTION: When the electronic component 1 is mounted on the substrate 2; holes 5 each having such a size that a band 3 can pass therethrough, and having a width at one portion less than the length of the cross-section of the band 3 in the longitudinal direction, are formed at the substrate 2 at both sides of the electronic component 1. The band 3 is extended over the electronic component 1 and each of both ends is passed through the hole 5, and each of both ends of the band 3 is twisted near the hole 5, and the band 3 and dummy lands 6 formed around the holes 5 on the surface of the substrate 2 having no electronic component 1 mounted thereon are connected with solder 8. COPYRIGHT: (C)2007,JPO&INPIT
|
