| 摘要 |
PROBLEM TO BE SOLVED: To provide a contact module and its manufacturing method easier to mount on an electronic component, a mother board, or the like than conventional one, and also to provide a member with a contact using the above contact module and its manufacturing method. SOLUTION: The contact module 1 comprising a spiral contactor 2 and a bump 3 under the spiral contactor 2 is inserted into a through-hole 11 formed on the mother board 10, and the bump 3 is caulked from a rear-face 10a of the mother board 10. With this, the contact module 1 is easily and appropriately fixed to and held by the mother board 10. COPYRIGHT: (C)2007,JPO&INPIT
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