发明名称 Printed circuit board having embedded capacitors using hybrid material and method of manufacturing the same
摘要 The present invention is related to a printed circuit board having embedded capacitors using a hybrid material and a method of manufacturing the same. This invention provides a printed circuit board having embedded capacitors using a material for a hybrid dielectric layer including liquid crystal polymer and ceramic powder, and a method of manufacturing such a printed circuit board.
申请公布号 US2006243479(A1) 申请公布日期 2006.11.02
申请号 US20060361078 申请日期 2006.02.22
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM TAE K.;OH JUN R.;KIM JIN C.
分类号 H05K1/03;H05K1/16 主分类号 H05K1/03
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