METHOD FOR CLEANING WAFER

摘要

A method for cleaning a wafer is provided to completely remove a water mark remaining on the surface of a wafer by additionally installing an IPA(isopropyl alcohol) cleaning bath with an IPA solution between a DIW(deionized water) rinse bath and a dry bath. A wafer(150) is cleaned by using HF. A cleaning process is performed on the wafer by using a DIW solution. The wafer is dipped into an IPA solution(115) for a predetermined interval of time. A material remaining on the surface of the wafer is removed by a dry method using IPA gas(175). The wafer can be dipped into the IPA solution for 5~10 minutes.