POLISHING APPARATUS, SEMICONDUCTOR-DEVICE MANUFACTURING METHOD USING SAME APPARATUS, AND SEMICONDUCTOR DEVICE MANUFACTURED BY SAME MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a polishing apparatus which prevents an offset load from acting on a wafer when its polishing pad overhangs the wafer.

SOLUTION: In the polishing apparatus, a first holder 65 of a plate member 61 having magnetism is so moved upward by a magnetic field generated from an electromagnet 35 disposed above a polishing pad 40 so as to be attracted to the polishing pad 40. Therefore, the polishing apparatus is so constituted that the polished surface 51 of a wafer 50 held by the first holder 65 is contacted with the polishing surface 41 of the polishing pad 40.

COPYRIGHT: (C)2007,JPO&INPIT