发明名称 |
Dicing die adhesive film for semiconductor |
摘要 |
A dicing die adhesive film for semiconductor of the present invention has a 3-layered structure including a first adhesive layer attached on the back of a semiconductor wafer; a second adhesive layer attached onto the first adhesive layer; and a dicing film attached onto the second adhesive layer, and therefore has an advantage that it can ensure reliability of the semiconductor packaging process since it may prevent the die-flying phenomenon and the poor pickup of the die in the dicing process and maintain a sufficient adhesive force between the die and the substrate upon die boding.
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申请公布号 |
US2006244132(A1) |
申请公布日期 |
2006.11.02 |
申请号 |
US20060413938 |
申请日期 |
2006.04.27 |
申请人 |
KANG BYOUNG-UN;KIM JAI-HOON;SEO JOON-MO;SUNG TAE-HYUN;SHIN DONG-CHEON;WI KYUNG-TAE |
发明人 |
KANG BYOUNG-UN;KIM JAI-HOON;SEO JOON-MO;SUNG TAE-HYUN;SHIN DONG-CHEON;WI KYUNG-TAE |
分类号 |
H01L23/34 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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