发明名称 Wire material payout device and wire solder
摘要 An object of the present invention is to provide a wire rod feeding device in which a soft wire rod can be inserted easily. To achieve this object, in the wire rod feeding device in accordance with the present invention, the wire rod is gripped and released, and is run out by a chuck body ( 7 ) which is movable back and forth, and opening means for keeping an opened state of the chuck body is provided.
申请公布号 US2006243851(A1) 申请公布日期 2006.11.02
申请号 US20050555856 申请日期 2005.11.03
申请人 SENJU METAL INDUSTRY CO., LTD. 发明人 ISHII KOU;YANAGAWA YOSHIAKI;MARUYAMA SHIGEKI
分类号 B23K3/06;B65H49/20;B65H51/18 主分类号 B23K3/06
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