| 摘要 |
Substrate shrinkage that occurs during manufacture of an electronic assembly (100A) is compensated for by the incorporation of a horizontal line (102,104), having a plurality of vertical graduations, across a horizontal portion of a substrate (100) and a vertical line (106,108), having a plurality of horizontal graduations, across a vertical portion of the substrate (100). The substrate (100) is then cured and an amount of substrate shrinkage is determined, based upon a location change in the graduations of the horizontal and vertical lines (102,104,106,108). In this manner, solder can be properly provided on solder pads of the substrate (100) responsive to the amount of substrate shrinkage. As such, electronic components (110,112,114,116) can be properly mounted to the solder pads of the substrate (100).
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