| 摘要 |
<p>A socket (30a) is provided with a contact terminal (40a) electrically connected with a ball contact (101) provided on an electronic component (100) to be tested; and a housing (31a) for supporting the contact terminal (40a). The contact terminal (40a) is provided with a BGA side contact section (41) brought into contact with the ball contact (101); a supporting section (43) supported by the housing (31a); a substrate side contact section (45) brought into contact with an electrode pad (61) of a socket board (60); a BGA side bending section (42) for bending a section between the BGA side contact section (41) and the supporting section (43); and a substrate side bending section (44) for bending a section between the supporting section (43) and the substrate side contact section (45). The BGA side bending section (42) and the substrate side bending section (44) are bent to have the BGA side contact section (41) and the substrate side contact section (45) position substantially in the same direction, with an axis line of the supporting section (43) at the center, on a projection flat plane substantially parallel to main planes (311, 312) of the housing (31a).</p> |
