| 摘要 |
This invention provides a method for manufacturing a solid plating material which has excellent electrical conductivity and durability, and the solid plating materials manufactured by this method, wherein a suspension liquid is made by mixing a fluid for coating that includes an organic binder, with a powder for plating having electrical conductivity and a metal powder to be used for binding, wherein then layers having the plating powder and the metal powder, and bound to the surfaces of core particles with the organic binder, are formed by means of injecting the suspension liquid on the surfaces of the core particles while the core particles are being agitated by centrifugal fluidization, and wherein then the core particles are heated until their temperature is above the melting temperature of the metal powder to be used for binding so as to remove the organic binder and to form deposited layers of the plating powder by melting the metal powder to be used for binding. If a powder having excellent electrical conductivity is used as the plating powder, solid plating materials having excellent electrical conductivity and durability can be manufactured. |
