| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device which surrounds the periphery of a semiconductor element with a resin by a simple process and holds openings without covering a light receiver. <P>SOLUTION: The method has a step of forming openings at specified positions of a thermosetting resin sheet having a melting viscosity of 10-300 Pa s when the sheet is heated to melt for sealing a semiconductor, a step of laminating the resin sheet on a circuit board with aligning the openings with semiconductor elements fixed to the circuit board, and a step of pressing the laminated resin thermosetting sheet at 0-0.5 MPa to heat and harden the sheet. <P>COPYRIGHT: (C)2007,JPO&INPIT |
