PRINTED CIRCUIT BOARD AND ELECTRONIC CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a printed circuit board and an electronic circuit substrate and manufacturing methods thereof capable of securing even a radiation effect while suppressing a defect in the bonding of an electronic part provided with a radiation plate. SOLUTION: The printed circuit board is formed with a radiation plate connector land 8 for connecting the radiation plate 16 provided at the electronic part 5, and an electrode connector land 7 for connecting an electrode 6 of the electronic part 5, and is further formed with a land 9 between the radiation connector land 8 and the electrode connector land 7. This configuration allows a widely sagged bonding material 15 to be bonded to the land 9 when the electronic part is bonded with a bonding material 13 by cutting the supply of the bonding material to the land 9, thereby enabling the printed circuit board to prevent the widely sagged bonding material 15 from reaching the electrode connector land 7 and also to prevent the coated amount of the bonding material from being reduced to decrease the widely sagged bonding material to also secure the radiation effect. COPYRIGHT: (C)2007,JPO&INPIT