| 摘要 |
PROBLEM TO BE SOLVED: To reinforce a bonding strength of a mother board with an interposer using a grounding land for the package shielding case or any other attached patterns. SOLUTION: In the package corresponding to the BGA and LGA mounting methods, when the LGA mounting is performed, a bonding strength of a metal pattern on the mother board with the package can be reinforced using a land attached for the bonding reinforcement which is never used in the BGA mounting case. COPYRIGHT: (C)2007,JPO&INPIT
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