| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board capable of suppressing solder bridges even a solder of high melting point is used, taking the fact into consideration that a solder solidifies just after coming off a jet to increase solder bridges when a jet type automatic soldering is applied on insert components using the solder whose melting point is 200°C or higher such as a lead-free solder. SOLUTION: A through-hole 11 for soldering components is formed on the rear side in advancing direction to the jet type automatic soldering device. A through-hole 12 for drawing a solder is formed corresponding to the through-hole 11 for soldering components to draw the solder of the through-hole 11 for soldering components. These two through-holes are connected together by a wiring pattern 17 (heat conductive material) for fitting the electrode of an insert component 20 by soldering on a printed wiring board 10. COPYRIGHT: (C)2007,JPO&INPIT
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