| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting method for semiconductor devices wherein, when a semiconductor device is bonded to a circuit board by thermocompression using an anisotropic conductive film, an uncured portion can be eliminated in the anisotropic conductive film. SOLUTION: The mounting method for semiconductor devices includes a sticking step and a bending step. In the sticking step, a semiconductor device 13 is placed over an anisotropic conductive film 26 having a surplus 41 protruded from under the semiconductor device 13, before the semiconductor device 13 is bonded to a circuit board 11 by thermocompression with the anisotropic conductive film 26 in-between. Then, the semiconductor device 13 is pressed from above to stick the anisotropic conductive film 26 to the underside thereof. In the bending step, the surplus 41 of the anisotropic conductive film 26 is bent along the circumference of the underside of the semiconductor device 13, and pressed against the side faces of the semiconductor device 13 and fixed there. COPYRIGHT: (C)2007,JPO&INPIT
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