| 摘要 |
PROBLEM TO BE SOLVED: To provide an ideal forming method of a film coating wherein, when an SOG film is formed on a substrate from a coating liquid containing alkoxy-silane compound, the temperature is accurately controlled to prevent the sudden shrinkage of the film coating, and the disappearance of a material forming glassy component in the coating liquid is prevented to suppress the occurrence of cracks in the SOG film, and the metal material forming a circuit is not fused and deformed. SOLUTION: In this forming method of the film coating, at least three ranks of processed object surface temperature ranges are set, and the temperature is gradually raised from a low temperature to dry the processed object on which a coating liquid is coated for forming the SOG film. Then, the processed object surface temperature is raised into the range of 250-500°C and is kept in the range of±3°C, and the baking process for the processed object is carried out to form the SOG film. COPYRIGHT: (C)2007,JPO&INPIT
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