| 摘要 |
PROBLEM TO BE SOLVED: To provide load lock equipment and processing method which can properly control the temperature of a substrate. SOLUTION: The load lock equipment has a carry-in port installed on the side of a carry-in-and-out portion for carrying a substrate in and out of the outside, and a carry-out port installed on the side of a processor for processing the substrate. The load lock equipment is equipped with a heating plate 71 for heating the substrate G which consists of the main body 75 formed of a porous material and a heating gas supply channel 76 for supplying heated heating gas to the main body 75 of the plate. The heating gas passes through the main body 75 of the plate and is blown out from the surface of the main body 75 to be supplied to the substrate G. COPYRIGHT: (C)2007,JPO&INPIT
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