发明名称 CONDUCTIVE PASTE
摘要 PROBLEM TO BE SOLVED: To provide a conductive paste which has an excellent low-temperature and short-time hardening performance and high conductivity, screen printing performance, bending resistance, connector insertion and extraction resistance, thermal resistance, moisture resistance, and durability in thermal shock resistance all together. SOLUTION: This is a conductive paste containing a conductive powder (A), an organic resin (B), a solvent (C), and an polyisocyanate compound having average number of isocyanate functional groups of 4.5 or more. It is preferable that the conductive powder (A) includes silver powder. The conductive powder can be utilized for forming a circuit of a component or an adhesive for home appliances, vehicles, and OA equipment or the like. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006302825(A) 申请公布日期 2006.11.02
申请号 JP20050126599 申请日期 2005.04.25
申请人 TOYOBO CO LTD 发明人 KONDO KOJI
分类号 H01B1/22;H01B1/24 主分类号 H01B1/22
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