发明名称 ELECTRONIC COMPONENT AND ELECTRONIC CONFIGURATION
摘要 An electronic component includes a substrate with outer contact areas including copper. Lead-free solder bumps are disposed on the outer contact areas of the electronic component. An electronic configuration includes an electronic component and a printed circuit board. The electronic component is mounted on the printed circuit board by lead-free solder electrical connections.
申请公布号 WO2006114267(A2) 申请公布日期 2006.11.02
申请号 WO2006EP03795 申请日期 2006.04.25
申请人 INFINEON TECHNOLOGIES AG;BIRZER, CHRISTIAN;BOCK, GERALD;ORT, THOMAS;RAKOW, BERND;SCHAETZLER, BERNHARD;SCHOTT, ALBERT;STEINER, RAINER;WAIDHAS, BERND;WALTER, JUERGEN 发明人 BIRZER, CHRISTIAN;BOCK, GERALD;ORT, THOMAS;RAKOW, BERND;SCHAETZLER, BERNHARD;SCHOTT, ALBERT;STEINER, RAINER;WAIDHAS, BERND;WALTER, JUERGEN
分类号 H01L23/498 主分类号 H01L23/498
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