发明名称 Laser machining apparatus, laser machining method and manufacturing method of semiconductor device
摘要 A laser machining apparatus includes a laser irradiating part having a laser oscillator and a beam shape converting mechanism, an optical detecting part that detects reflected light from a workpiece by a laser of a specific wavelength emitted from the laser irradiating part, and a laser control part that controls at least one of the laser oscillator and the beam shape converting mechanism based on a detection result of the optical detecting part. The optical detecting part selectively detects light of the specific wavelength.
申请公布号 US2006243708(A1) 申请公布日期 2006.11.02
申请号 US20060412046 申请日期 2006.04.27
申请人 发明人 IKENOUE HIROSHI
分类号 B23K26/03;B23K26/38 主分类号 B23K26/03
代理机构 代理人
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