发明名称 |
PRINTED CIRCUIT BOARD WITH EMBEDDED CAPACITORS USING HYBRID MATERIALS, AND MANUFACTURING PROCESS THEREOF |
摘要 |
A printed circuit board with embedded capacitors, and a method for manufacturing the PCB are provided to reduce a signal loss when transferring signals by using hybrid materials as a dielectric layer for the PCB(Printed Circuit Board). A first circuit layer and a fourth circuit layer are formed on respective surfaces of a double-sided copper laminate plate. Second and third circuit layers are formed on respective copper films of a hybrid copper laminate plate. Copper films are laminated on both sides of a hybrid dielectric layer containing liquid crystal polymer and ceramic powders. The second circuit layer includes a lower electrode and a first circuit pattern. The third circuit layer includes an upper electrode and a second circuit pattern. The lower and upper electrodes face each other. An insulation layer(107) is laminated between the double-sided copper laminate plate and the hybrid copper laminate plate. A single-sided copper laminate plate is laminated on the third and fourth circuit layers. A blind via-hole(113) and a through-hole(112) are formed on predetermined portions of the single-sided copper laminate plate. A plating layer is plated on the via-hole and the through-hole. |
申请公布号 |
KR20060112906(A) |
申请公布日期 |
2006.11.02 |
申请号 |
KR20050035626 |
申请日期 |
2005.04.28 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM, TAE KYOUNG;OH, JUN ROK;KIM, JIN CHEOL |
分类号 |
H05K1/16 |
主分类号 |
H05K1/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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