| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent chip cracks and chip chipping in the assembly of a semiconductor device. <P>SOLUTION: By preparing a lead frame 1 for which the thickness of the end on the tab side of silver plating 8 for wire connection formed on a suspension lead 1e is formed thinner than the silver plating 8 on a lead and loading a semiconductor chip 2 on a tab 1b thereafter, since the entire surface of the silver plating 8 is crushed on the suspension lead 1e, the semiconductor chip 2 is prevented from being in contact with the silver plating 8 when loading the chip. Thus, the semiconductor chip 2 can slide on the tab 1b without being in contact with the silver plating 8 during die bonding, damages are reduced on the semiconductor chip 2 when loading the chip, and the chip cracks and chip chipping are prevented in the semiconductor device. <P>COPYRIGHT: (C)2007,JPO&INPIT |
