发明名称 THIN FILM MACHINING MASK, AND THIN FILM DEPOSITION METHOD OF WORKPIECE
摘要 <P>PROBLEM TO BE SOLVED: To provide a thin film machining mask capable of correctly depositing a thin film without damaging a workpiece, and a thin film deposition method of the workpiece by using the thin film machining mask. <P>SOLUTION: The thin film machining mask comprises an upper mask 30 to be tightly attached to a face side of a workpiece, a lower mask 40 to be tightly attached to a back side of the workpiece, and an outline mask 50 which is interposed between the upper mask 30 and the lower mask 40 and has an aperture 54 corresponding to the outline of the workpiece. Through-holes 30a, 40a corresponding to areas of the thin film deposited on the workpiece are formed in the upper mask 30 and/or the lower mask 40. The outline mask 50 is formed thicker than the workpiece, and an opening end face of the aperture 54 forms an upward stepped part 56. A recess 52 having the opening area larger than that of the aperture 54 is formed in the thin film machining mask. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006299343(A) 申请公布日期 2006.11.02
申请号 JP20050122296 申请日期 2005.04.20
申请人 SEIKO EPSON CORP 发明人 HABA SHINJI;IKEGAMI YASUMITSU
分类号 C23C14/50;C23C14/04;C23C14/34;H01L41/18;H01L41/22;H01L41/29;H03H3/02 主分类号 C23C14/50
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