| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring substrate with high reliability by holding a firm connection of a penetration conductor of the wiring substrate and a member such as a probe pin and a wire connected to a driving part of the penetration conductor. <P>SOLUTION: The wiring substrate sequentially forms a wiring conductor 4 and an insulating layer 3 on an insulating substrate 2 and forms the wiring conductor 4 and the electrically connected penetration conductor 5 in the insulating layer 3 so that an upper end is derived on the upper face side of the insulating layer 3. A support member 6 higher Young's modulus than the penetration conductor 5 is formed on at least one of a surface and an inside of the penetration conductor 5. <P>COPYRIGHT: (C)2007,JPO&INPIT |
