发明名称 |
DIAMOND SUBSTRATE AND METHOD FOR FABRICATING THE SAME |
摘要 |
A diamond substrate is provided to prevent a diamond layer from being deformed by forming the diamond layer on the upper surface of a SiC layer. A diamond layer(120) is formed on the upper surface of a SiC layer(130) for preventing a diamond layer from being deformed. A semiconductor layer(140) is formed on the lower surface of the SiC layer to eliminate crystalline nonuniformity between the diamond layer and the semiconductor layer. The diamond layer is a material selected from a group composed of a single crystalline diamond layer and a polycrystalline diamond layer.
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申请公布号 |
KR20060113450(A) |
申请公布日期 |
2006.11.02 |
申请号 |
KR20060037500 |
申请日期 |
2006.04.26 |
申请人 |
KINIK COMPANY |
发明人 |
CHANG HSIAO KUO;HUANG JEN SHEUAN;CHEN CHIH PENG;CHEN NA LING;WEN SHIH PANG |
分类号 |
H01L21/84;H01L21/20;H01L33/32 |
主分类号 |
H01L21/84 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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