发明名称 |
MANUFACTURING METHOD OF LIGHT-EMITTING DEVICE, AND MANUFACTURING METHOD OF LIGHT-EMITTING DEVICE UNIT USING LIGHT-EMITTING DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To reduce color variations for each light-emitting device by achieving an optimum combination of an LED chip and a wavelength converter in a method of manufacturing the light-emitting device and a method of manufacturing a unitized light-emitting device. <P>SOLUTION: The LED chip is mounted at the mounting section of the body of the light-emitting device (S2); the luminous characteristics of the LED chip are measured while it is mounted on the body of the light-emitting device (S3); the LED chip is ranked based on characteristics related to the radiation energy of the LED chip and brightness calculated from the radiation energy, and the characteristics of the luminous spectrum of the LED chip obtained from the measurement (S4); a suitable wavelength converter is selected from wavelength conversion sections having different design conditions (S7) designed (S5) and manufactured (S6) corresponding to each rank of the LED chip; and the LED chip corresponding to each rank and the wavelength converter are combined to assemble the light-emitting device. <P>COPYRIGHT: (C)2007,JPO&INPIT |
申请公布号 |
JP2006303140(A) |
申请公布日期 |
2006.11.02 |
申请号 |
JP20050121962 |
申请日期 |
2005.04.20 |
申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
MORI SATORU;SUGIMOTO MASARU;HASHIMOTO TAKUMA;KOBAYASHI MASAKI;SHIOHAMA EIJI |
分类号 |
H01L33/50;H01L33/60 |
主分类号 |
H01L33/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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